PRIMS basic magnetron sputtering system

The Basic Magnetron Sputtering System is a compact and easy-to-use thin-film deposition platform designed for research laboratories, universities, and industrial R&D environments. Its optimized chamber volume and efficient pumping system enable rapid pump-down times, allowing users to perform more experiments in less time.

Designed with simplicity and reliability in mind, the system provides all essential tools required for magnetron sputtering processes within a compact footprint. The straightforward configuration minimizes operational complexity while ensuring stable and repeatable deposition conditions.

Supporting up to three 2-inch magnetron sources, the system is suitable for the deposition of a wide range of metallic and compound thin films used in materials science, surface engineering, electronics, optics, and educational research. The combination of proven vacuum technology, intuitive operation, and cost-effective design makes it an ideal choice for laboratories seeking a practical sputtering solution without unnecessary complexity.

The fast pumping system (with a manual throttle valve) combined with the small volume of the process chamber allows you to reach the base pressure in a short time. The process chamber is equipped with connecting flanges in HV standard for connecting current and future equipment, including: 

• up to 3 magnetron sources 2”,
• substrate manipulator,
• pumping system,
• protection shield against cross-contamination,
• quartz balance,
• viewport – observation windows with shutter,
• vacuum gauges,
• pyrometer.

• Plug-and-work design
• Compact and easy-to-use mobile unit for rapid thin-film deposition and coating process evaluation
• Process chamber with a large front-access vacuum door for convenient target and substrate exchange
• Equipped with PREVAC MS2 A 100 ISO-K magnetron sputtering sources and the novel M600DC-PS power supply
• Substrate stage for samples up to 2″ in diameter
• Process chamber diameter: Ø 355 mm
• Three ports for 2″ magnetron sputtering sources
• Viewport with protective shutter for process observation
• Internal protection shield minimizing cross-contamination
• Base pressure in the 10⁻⁷ mbar range
• Fast pumping system with integrated vacuum gauges
• Automatic argon gas dosing via mass flow controller (MFC)
• Manual throttle valve for process pressure adjustment
• Rigid frame mounted on wheels for easy relocation within the laboratory

• Substrate heating up to 600°C or 800°C
  Co-deposition 
  Substrate stage rotation 
  DC or RF sputtering
  Deposition rate measurement 
  Additional gas dosing system
  Pyrometer
  Computer controlled proces automation