PRIMS basic magnetron sputtering system

A compact and fully integrated sputter deposition system designed for reproducible thin-film deposition. The all-in-one plug-and-play design combines the vacuum chamber, pumping system, power supplies and process controls in a single mobile unit, minimizing installation requirements and laboratory footprint.

Description

The Basic Magnetron Sputtering System is a compact and easy-to-use thin-film deposition platform designed for research laboratories, universities, and industrial R&D environments. Its optimized chamber volume and efficient pumping system enable rapid pump-down times, allowing users to perform more experiments in less time.

Designed with simplicity and reliability in mind, the system provides all essential tools required for magnetron sputtering processes within a compact footprint. The straightforward configuration minimizes operational complexity while ensuring stable and repeatable deposition conditions.

Supporting up to three 2-inch magnetron sources, the system is suitable for the deposition of a wide range of metallic and compound thin films used in materials science, surface engineering, electronics, optics, and educational research. The combination of proven vacuum technology, intuitive operation, and cost-effective design makes it an ideal choice for laboratories seeking a practical sputtering solution without unnecessary complexity.

The fast pumping system (with a manual throttle valve) combined with the small volume of the process chamber allows you to reach the base pressure in a short time. The process chamber is equipped with connecting flanges in HV standard for connecting current and future equipment, including:

up to 3 magnetron sources 2”,
substrate manipulator,
pumping system,
protection shield against cross-contamination,
quartz balance,
viewport – observation windows with shutter,
vacuum gauges,
pyrometer.

Features

Plug-and-work design
Compact and easy-to-use mobile unit for rapid thin-film deposition and coating process evaluation
Process chamber with a large front-access vacuum door for convenient target and substrate exchange
Equipped with PREVAC MS2 A 100 ISO-K magnetron sputtering sources and the novel M600DC-PS power supply
Substrate stage for samples up to 2″ in diameter
Process chamber diameter: Ø 355 mm
Three ports for 2″ magnetron sputtering sources
Viewport with protective shutter for process observation
Internal protection shield minimizing cross-contamination
Base pressure in the 10⁻⁷ mbar range
Fast pumping system with integrated vacuum gauges
Automatic argon gas dosing via mass flow controller (MFC)
Manual throttle valve for process pressure adjustment
Rigid frame mounted on wheels for easy relocation within the laboratory

Options

Substrate heating up to 600°C or 800°C
Co-deposition
Substrate stage rotation
DC or RF sputtering
Deposition rate measurement
Additional gas dosing system
Pyrometer
Computer controlled proces automation

Applications

Applications	Examples
Single and multilayer conductor films (for microelectronics and semiconductor devices)	Al, Mo, Mo/Au, Ta, Ta/Au
Barrier layers for semiconductor metallizations	TiN, W-Ti
Magnetics films	Fe, Co, Ni, Fe-Al-Si, Co-Nb-Zr, Co-Cr, Fe-Ni-Cr, Fe-Si, Co-Ni-Cr, Co-Ni-Si
Optical coatings – metallic (reflective)	Cr, Al, Ag
Optical coatings – dielectric	MgO, TiO₂ , ZrO₂
Photomasks	Cr, Mo, W
Transparent gas/vapor permeation barriers	Al₂O₃
Transparent electrical conductors	InO₂, SnO₂,In-Sn-O (ITO)