Mini MBE systems

• Plug&work construction
• Economical solution, designed for the lab with limited space
• Suited for growth of elements from groups III/V, II/VI as well as other heterostructures
• Up to 8 evaporation sources DN 40CF ports with power supplies
• 4-axes motorized or manual manipulator with high precision temperature control: resistive heating up to 1000°C, EB heating up to 1400°C, water or LN₂ cooling (simpler manipulator available on request)
• Prepared for Flag-style substrate/sample holders
• Base pressure with LN₂ shroud: <2×10^-10 mbar
• Small process chamber Ø 250 mm with an exchangeable bottom flange
• Pumping system (based on the backing pump, TMP, ion pump & TSP)
• Quartz balance for deposition rate measurement and thickness monitor, with Z manipulator to measure rate in focus point
• RHEED/TorrRHEED with equipment
• Additional independent shutters on 40CF ports
• Load Lock chamber for single sample holder or with carrousel (as storage) for 6 or 12 Flag style substrate holders
• Reliable and fast linear transferring system from load-lock to the process chamber
• Vacuum gauges with equipment
• Viewports – observation windows with shutter
• Cooling system with integrated blow-off line before bakeout
• Bakeout system
• Adjustable rigid main frame with large wheels for easy placement of the system
• 19“ cabinet with electronic units

The process chamber contains 8 ports for evaporation sources and the substrate stage is intended for 10×10 mm samples, with a heating & rotation option.

The deposition process can be controlled over a wide temperature range (from LN₂ up to 1400˚C) and can be fully software programmed and controlled via a PLC controller.

The process chamber is equipped with connecting flanges in UHV standard for connecting current and future equipment, including:

• up to 8 effusion cells with flange DN40CF (high or low-temperature, single or multi-filament),
• substrate manipulator with a temperature range (from LN₂ up to 1400˚C),
• pumping system (based on the backing pump, TMP, ion pump & TSP),
• vacuum gauges with equipment,
• entry port for linear transferring systems or transport box,
• quartz balance, thickness monitor with Z manipulator,
• RHEED/TorrRHEED with equipment,
• motorised or manual shutter (following the substrate) for vicinal layers or masks,
• additional gas dosing eg. for the reactive deposition process,
• viewports – observation windows with shutters,
• residual gas analyser,
• heated viewports for diagnostic devices.

The final design and functionality depend on the system configuration.

A pumping system combined with the small volume of the process chamber allows for reaching the base pressure in a short time, where the base pressure is guaranteed below 5×10^-10 mbar.

The system is equipped with advanced, easy-to-use power supplies and electronic devices controlling and supporting the sources and the whole included research equipment.

• Motorised or manual shutter (following the substrate) for vicinal layers or masks
• Protection shield against cross-contamination
• Vacuum suitcase (transport box) with a port in the load-lock chamber
• Additional gas dosing eg. for the reactive deposition process
• Residual gas analyser
• Heated viewports for the diagnostic devices
• Pyrometer
• Full control deposition process & equipment by PLC unit and Synthesium software