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Magnetron source | 2-inch targets

Magnetron source for applying thin layers with high homogeneity in the sputtering process. Intended for 2-inches diameter targets.

Depending on the required conditions of the sputtering process, we offer 2 types of sources: type B & C.

All types are fully compatible with our M600DC-PS power supply as well as all other DC, RF and pulsed DC power supplies available on the market.

SKU: 448-1 Categories: ,

Source type A

The magnetron source type A is used to apply thin layers with high homogeneity in the sputtering process. The source is compatible with UHV conditions. Thanks to the integrated in-situ tilt system, it can be used in both standard and custom geometry chambers. By using the dome-type design we minimize the space needed to open the shutter.

Mounting flange DN 63 CF, DN 100 ISO-K*
Max. power (DC mode) 400 W DC **
Max. power (RF mode) 400 W RF **
Max. voltage DC 1200 V
Connector DC/RF type 7/16
Target
   form circular
   diameter 2″ (50.8 mm) ± 0.2 mm
   thickness 1 – 6 mm
   cooling indirect
Water flow min. 1 l/min
Max. inlet water temperature < 28 °C
Max. water pressure 3 bar
Tubing diameter Ø6×1 mm PTFE
Magnet material Neodymium Iron Boride (NdFeB)
Magnet max. temperature 200°C
Internal pneumatic shutter yes
Shutter type dome type or flat swing
Insitu tilt module yes, range +45° ÷ -10°
Chimney yes
Dedicated materials:
typical rates [nm/min] for 200 W:
   Cu 40,87 nm/min ( distance: 150 mm; target thickness: 3 mm)***
   Ti 10,82 nm/min (distance: 150 mm; target thickness: 3 mm)***
   Fe 15,94 nm/min (distance: 150 mm; target thickness: 1 mm)***
Internal gas inlet yes (VCR standard)
Working gas Ar
Max. working pressure 5×10-3 – 1×10-1 mbar
Optimal working pressure 5×10-3 – 5×10-2 mbar

* Other mounting flanges on request
** The maximum power is determined by the target material
*** Distances depend on the geometry of the chamber and the magnetrons

Source type B

The magnetron source type B is used to apply thin layers with high homogeneity in the sputtering process. The source is compatible with UHV conditions. The source is designed for sputtering magnetic and ferromagnetic materials. It can operate on up to 7 mm thick targets.

Mounting flange DN 63 CF
Max. power (DC mode) 400 W DC **
Max. power (RF mode) 400 W RF **
Max. voltage DC 1200 V
Connector DC/RF type 7/16
Target
   form ring
   diameter 2″ (50.8 mm) ± 0.2 mm
   thickness 1 – 7 mm (magnetic & non-magnetic)
   cooling indirect
Water flow min. 1 l/min
Max. inlet water temperature < 28 °C
Max. water pressure 3 bar
Tubing diameter Ø6×1 mm PTFE
Magnet material Samarium Cobalt (SmCo)
Magnet max. temperature 350°C
Internal pneumatic shutter yes
Shutter type dome type or flat swing
Insitu tilt module yes, range +45° ÷ -10°
Chimney yes
Dedicated materials:
typical rates [nm/min] for 200 W:
   Cu 32,84 nm/min ( distance: 160 mm; target thickness: 3 mm)***
   Ti 10,07 nm/min (distance: 160 mm; target thickness: 3 mm)***
   Fe 9,63 nm/min (distance: 160 mm; target thickness: 3 mm)***
Internal gas inlet yes (VCR standard)
Working gas Ar
Max. working pressure 5×10-3 – 1×10-1 mbar
Optimal working pressure 5×10-3 – 5×10-2 mbar

* Other mounting flanges on request
** The maximum power is determined by the target material
*** Distances depend on the geometry of the chamber and the magnetrons

Source type C

The magnetron source type C is both RF‑ and DC‑compatible and can deposit many classes of materials: conductors, semiconductors, and insulators. The source enables the creation of uniform, homogeneous and small-grained thin films; with such advantages as high density (low void area), high specularity (reflectance), and free of radiation damage and broken bonds.

Mounting flange DN 63CF or DN 63ISO‑K for model MS2/63C1,
or DN 100CF or DN 100ISO‑K for model MS2/100C1
Max. power (DC mode) 400 W DC **
Max. power (RF mode) 400 W RF **
Max. voltage DC 1200 V
Connector DC/RF type 7/16
Target Keeper standard
   form circular
   diameter 2″ (50.8 mm) ± 0.2 mm
   thickness non-magnetic: 1-6 mm; magnetic: Fe 1mm, Ni 1mm
   cooling indirect
Water flow min. 1 l/min
Max. inlet water temperature < 28 °C
Max. water pressure 3 bar
Tubing diameter Ø6×1 mm PTFE
Magnet material Neodymium Iron Boride (NdFeB)
Magnet max. temperature 200 °C
Internal pneumatic shutter yes
Shutter type dome type or flat swing
Insitu tilt module yes, range +45° ÷ -10°
Chimney yes
Dedicated materials:
typical rates [nm/min] for 200 W:
   Cu 34,70 nm/min (distance: 100 mm; target thickness: 3 mm)***
   Ti 6,8 nm/min (distance: 100 mm; target thickness: 3 mm)***
   Fe 32,41 nm/min (distance: 100 mm; target thickness: 1 mm)***
Internal gas inlet yes (VCR standard)
Working gas Ar
Max. working pressure 5×10-3 – 1×10-1 mbar
Optimal working pressure 5×10-3 – 5×10-2 mbar

* Other mounting flanges on request
** The maximum power is determined by the target material
*** Distances depend on the geometry of the chamber and the magnetrons

Features

  • With or without insitu tilt module
  • Range of mounting flanges
  • Chimney as standard
  • Pneumatic dome type or side swing shutter
  • Indirectly cooled

Options

  • Mass Flow Controller (MKS MF1)
  • Customized length
  • Z manipulator
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