Source type B
The magnetron source type B is used to apply thin layers with high homogeneity in the sputtering process. The source is compatible with UHV conditions. The magnetron source is designed for sputtering magnetic and ferromagnetic materials. It can operate on targets up to 7 mm thick.
Mounting flange | DN 160 CF* |
Max. power (DC mode) | 600 W DC ** |
Max. power (RF mode) | 600 W RF ** |
Max. voltage DC | 1200 V |
Connector DC/RF | type 7/16 |
Target | |
form | ring |
diameter | 3″ (76.2 mm) ± 0.2 mm |
thickness | 1 – 7 mm (magnetic & non-magnetic) |
cooling | indirect |
Water flow | min. 1 l/min |
Max. inlet water temperature | < 28 °C |
Max. water pressure | 3 bar |
Tubing diameter | Ø6×1 mm PTFE |
Magnet material | Samarium Cobalt (SmCo) |
Magnet max. temperature | 350°C |
Internal pneumatic shutter | yes |
Shutter type | dome type or flat swing |
Insitu tilt module | yes, range +45° ÷ -10° |
Chimney | yes |
Dedicated materials: | |
typical rates [nm/min] for 200 W: | |
Cu | 18,72 nm/min (distance: 170 mm; target thickness: 3 mm)*** |
Ti | 4,10 nm/min (distance: 170 mm; target thickness: 3 mm)*** |
Fe | 5,16 nm/min ( distance: 170 mm; target thickness: 3 mm)*** |
Internal gas inlet | yes (VCR standard) |
Working gas | Ar |
Max. working pressure | 5×10-3 – 1×10-1 mbar |
Optimal working pressure | 5×10-3 – 5×10-2 mbar |
* Other mounting flanges on request
** The maximum power is determined by the target material
*** Distances depend on the geometry of the chamber and the magnetrons